Douglas Copen, Senior Packaging Safety Specialist with Nestle has just been added to the Conference Program at RadTech 2018, May 7-9, in Chicago www.radtech2018.com. Mr. Copen will be speaking on “Packaging Food Safety Concerns for Inks from a Brand Owner Perspective.” in a special EHS session taking place on Wednesday, May 9. Also in the session, Lynn Bergeson of Bergeson & Campbell will present on “What RadTech Members Need to Know about New TSCA,” reviewing what has happened, what EPA is poised to do next, and what provisions are expected to have the greatest impact on commercial operations. This session will be followed by a special meeting for attendees to discuss possible Association initiatives to address “New TSCA” concerns (please contact Gary Cohen at RadTech for information and if you would like to attend).
A new session has also just been added to the RadTech 2018 Conference Programming: New Technology Trends. Chaired by Sudhakar Madhusoodhanan and Ashwin Chockalingam of Applied Materials, the session will include: Use of High Refractive Index Materials in Display and Lighting Applications (including OLED Displays, HD Displays, OLED lighting, LED lighting); Radiation Cured Parts: Impact of Semiconductor Wafer Cleaning; Development of Functional Films and R2R Processes (for display screens and other applications); and Hydrophilicity Enhancement of UV Cured Acrylic Materials.
RadTech 2018 features over 100 presentations and 80 exhibitors. Discounted registration is available through April 20, for more information and to sign-up to join us, please visit www.radtech2018.com.