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Call for Papers
Technical Presentations & Case Studies
Abstracts Due: October 16, 2026 | Final Paper Due: April 16, 2027
Bring your challenge. Find your solution. Join us at the 2027 RadTech UV+EB Technology & Conference, the premier event for the UV+EB industry. This is where the people who formulate UV/EB materials and the people who use them solve problems together. We are building the 2027 program around a single idea: companies arrive with the real challenges, questions, and problems holding their products back, and they leave with the partnerships, suppliers, and chemistries needed to move those products forward.
The 2027 focus is on new applications and new materials: specifically, materials formulators can put to work now to make what end users actually need. RadTech 2027 will showcase both the proven applications that continue to drive UV+EB adoption and the next-generation opportunities that can expand it. We are especially interested in presentations that connect new materials, chemistries, equipment, and process advances to real end-user needs across industrial coatings, wood coatings and finishing, packaging, advanced manufacturing, additive manufacturing, electronics, optics, medical devices, and other emerging applications.
NEW: Case Study Track
Alongside our traditional technical presentations, we are specifically inviting case study presentations. Tell us about a real problem, what you tried, what worked, what didn’t, and the result. Wins and instructive failures both welcome.
SPOTLIGHT: Photoinitiators
With evolving regulatory pressure on several widely used photoinitiators, the 2027 program puts a deliberate spotlight on photoinitiator technology and development, including next-generation, low-migration, polymeric, and regulatory-ready chemistries.
We invite you to submit an abstract for a technical presentation or case study, not exceeding 25 minutes in length, followed by a 5-minute Q&A session. Complete the online Abstract Submission Form before October 16, 2026, providing a clear description of your paper for review by the Conference Committee. Space is limited, so timely submission is essential.
Speakers receive a speaker’s guide to help prepare the written and oral presentation. We encourage terminology consistent with the RadTech Glossary, available at radtech.org/intro-to-uv-eb/uv-glossary. All speakers are eligible for a 50% discount on registration fees.
For RadTech 2027, speakers may submit a technical paper, a copy of their presentation slides, or both for the technical proceedings. We strongly encourage you to write and submit a full technical paper. The deadline for submitting your final paper for publication is APRIL 16, 2027.
Industry Challenges Seeking Solutions
Every organization working with UV+EB is facing unsolved problems: properties that current chemistry cannot quite reach, formulations that work in the lab but not on the line, regulatory requirements that have just shifted, or application needs that still lack a practical solution. The 2027 program exists to put those problems in front of the people who can help solve them. We invite presentations from members, non-members, end users, suppliers, government research labs, universities, and others that either pose a hard, real-world challenge to the industry or show how a team solved one. Both help move the industry forward.
Submissions that speak to these recurring themes are especially welcome:
- Performance limits — durability, weatherability, corrosion resistance, optical clarity, and dimensional precision.
- Enabling chemistry — stabilization of reactive systems, next-generation and regulatory-ready photoinitiators, and hard-to-reach property targets.
- Bridging gaps — from lab to production line, and from academic research to industry-relevant practice.
Suggested Topics
ADVANCES IN CHEMISTRIES
Low-migration & polymeric photoinitiators
Monomers / Diluents
Oligomers / Resins
Cationic Curing
Thiol-Ene & Hybrid Systems
Bio-Based / Renewable
Waterborne
100% Solids Formulations
Novel Chemistry
ADVANCED MATERIALS
Low-shrinkage transparent systems
Biomaterials & Bio-Based
Smart & Self-Healing
Antimicrobial
Fire Retardant
Conductive Polymers
Nanomaterials
PRINTING + PACKAGING
UV Inkjet for Apparel & Textiles
Energy-curable inks & OPVs
Indirect Food Contact
Low Migration
INDUSTRIAL APPLICATIONS
Direct-to-Metal / Metal Finishing
Wood Coating
Powder Coating
New Industrial Applications
3D PRINT / ADDITIVE MFG
Equipment & Applications
Industrial Applications
Regenerative Medicine
ELECTRONICS / DEVICES
Displays & Flexible Displays
Photovoltaics
Fiber Optics
ELECTRONICS / DEVICES
Displays & Flexible Displays
Photovoltaics
Fiber Optics
SEMICONDUCTOR & AI INFRASTRUCTURE
Memory & HBM stacking (underfills, adhesives)
Data center materials & thermal
Enabling the AI hardware build-out
OPTICS & REPLICATION
Nanoimprint Lithography
Dimensionally critical transparent parts
LED TECHNOLOGY
Equipment Innovations
Economics / Case Studies
ADHESIVES
Wearables
Hot Melt
AUTOMOTIVE
Displays + Electronics
LiDAR + Autonomous
MEDICAL
Dental
FORMULATION PARAMETERS
Modeling
Lab Efficiency
Advanced Formulations
ADVANCES IN EQUIPMENT
Substrate Treatment
3-Dimensional Curing
TESTING & MEASUREMENT
Degree of Cure
Adhesion
Analytical Methods
Process Control
Questions? Contact the RadTech Conference Committee at mickey@radtech.org.